XinAn PCB
Manufacturing Capabilities
Advanced equipment and processes to meet your most demanding PCB specifications.
Production Highlights
- Up to 12 layers (focus on 1-4 layers for optimal quality)
- Copper weights up to 20oz (thick copper specialty)
- Controlled impedance with ±10% tolerance
- Advanced drilling & routing (CNC precision)
- AOI, Flying Probe test, X-ray inspection
- Sample to volume production flexibility
Advanced Equipment
LDI Machine
Laser Direct Imaging for fine patterns
AOI System
Automatic Optical Inspection
Flying Probe Tester
100% electrical testing
X-Ray Inspection
BGA and hidden via inspection
Impedance Tester
Controlled impedance verification
CNC Drilling
High-precision hole drilling
Detailed Technical Specifications
Image Transfer (Pattern)
| Parameter | Current | Future |
|---|---|---|
| Min Line Width/Space (1oz) | 3/3 mil | 2.5/2.5 mil |
| Line Width/Space Tolerance | ±20% | ±10% |
| Etching Undercut | ≤1.0 mil | - |
| Etching Factor | 2-4 | - |
| Etching Uniformity | >95% | - |
Surface Finish Options
| Type | Thickness |
|---|---|
| OSP | 0.2um - 0.5um |
| HASL (Lead-free) | 40U" - 1000U" |
| ENIG | Au: 1-5U", Ni: 100-300U" |
| Immersion Silver | 5-15U" |
| Immersion Tin | 0.8-1.2um |
Solder Mask Specifications
| Parameter | Current Capability | Future Capability |
|---|---|---|
| S/M Registration | ±3 mil (0.075mm) | ±2 mil (0.05mm) |
| Min Solder Dam | 6 mil | - |
| Min S/M Pad Size | 10 mil (0.25mm) | 8 mil (0.20mm) |
| S/M Thickness (Copper) | 0.5-2.0 mil | - |
| S/M Thickness (Base) | 0.8-2.0 mil | - |