XinAn PCB
Communication PCBA
High-frequency telecom assembly
Communication PCBA
High-frequency telecom assembly
Advanced PCBA for 5G base stations and communication modules. High-layer-count PCBs with precision impedance-controlled assembly.
Service Models
Full TurnkeyPartial Turnkey
Assembly Specifications
| Parameter | Specification |
|---|---|
| PCB Layers | 4 - 12 |
| Base Material | FR-4 (TG170+) |
| Surface Finish | ENIG / Immersion Silver |
| SMT Precision | ±0.025mm |
| Min Component | 0201 |
| Solder Type | Lead-free reflow |
| SMT Lines | 60 |
| Daily Capacity | 4000m² |
| BGA Rework | Yes |
Communication PCBA
Advanced PCBA for 5G base stations and communication modules. High-layer-count PCBs with precision impedance-controlled assembly.
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