Manufacturing Capabilities

We support HDI (High Density Interconnect) construction with laser-drilled microvias down to 0.1mm diameter and sequential lamination for 1+N+1 and 2+N+2 buildup structures. Laser drilling uses UV laser ablation to form blind vias connecting adjacent layers, enabling higher routing density than mechanical drilling allows. Our sequential lamination process bonds and drills additional layers onto a completed core, allowing blind and buried via combinations that reduce board size while increasing I/O density. HDI capability is available on 4-layer and above constructions. Typical applications include smartphone modules, wearable devices, and compact industrial controllers where component density exceeds the routing capacity of conventional through-hole-only designs. Contact our engineering team for stackup consultation on HDI projects.

Our facility processes PTFE-based and ceramic-filled high-frequency laminates including Rogers, Taconic, and Arlon series. We handle the specific process requirements of these materials: adjusted drilling parameters to prevent delamination, plasma desmear for PTFE hole preparation, and modified lamination profiles for hybrid stackups combining RF laminate layers with FR-4 structural layers. Hybrid (mixed-dielectric) stackups are a cost-effective approach for designs that require RF performance on specific layers while using standard FR-4 for digital signal and power distribution layers. We have established lamination profiles for common hybrid combinations and can advise on material compatibility, bonding film selection, and registration considerations for mixed-media multilayer builds.