XinAn PCB

IC Substrate Capability

Reference the IC substrate capability table for materials, minimum geometry, stackup thickness, and process support.

This page restructures the source IC substrate capability PDF into a direct-reference table set. The underlying values and units are preserved from the source file so engineers can compare fine-line, stackup, and process constraints without re-reading the original PDF.

The table order follows the original 2-page PDF and covers all 28 rows.
Values, units, and stackup expressions are preserved from the source; only page-level explanatory text is localized.
Minor OCR noise from the source PDF is retained where needed to keep the structured data auditable.

Page 1 / 2

No.	Item	Unit	Data Sheet
1	Sheng Yi	Core/P.P	SI643HU, SI10U, SI09U, SI07U, SI05U
2	Mitsubishi Gas Chemical	Core/P.P	HL832mNXA, HL832NS, HL832NSR(LC)
3	DooSan	Core/P.P	DS-7409HGB(S), DS-7409HGB(LE), DS-7409HGB(X)
4	Panasonic	Core/P.P	R1515E/R1515H
5	Other Materials	Core/P.P	E679FGB, E770G(LH), BT-NSF(LCA)
6	Layer	Layer	1-16layer
7	Min pattern size	um	25
8	Min pattern Space	um	25
9	Min Pad	um	80
10	Min BGA Center Space	um	250
11	2L Min Thickness	um	80
12	2L Min thickness/core/PP Thickness	um	80/30
13	4L Min thickness/core/PP Thickness	um	200/50/20
14	6L Min thickness/core/PP Thickness	um	240/50/20
15	8L Min thickness/core/PP Thickness	um	330/50/20

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No.	Item	Unit	Data Sheet
16	Solder mask Color		Green, Black
17	Solder resist		EG23A, AUS308, AUS320, AUS410
18	Surface treatment		Soft Gold Plating, Hard Gold Plating, ENIG, OSP
19	Flatness	um	5max
20	Min hole size	wn	100
21	Min Laser hole size	um	50
22	Min thickness tolerance	umi	30
23	Min PP	um	25
24	Min Core	um	40
25	Minimum Finger Center Distance	um	65
26	Min para-position accuracy	um	15
27	Support Process		Subtraction process, mSAP Process
28	Soldermask tolerance	um	5