XinAn PCB
Standard PCB Capability
Complete standard PCB process limits, dimensional tolerances, drilling, solder mask, and reliability data.
This page organizes the source iPCB standard PCB capability PDF into structured tables for direct reference. Numeric values, units, and range expressions are kept as close to the source as possible, while explanatory notes highlight OCR noise or unusual wording that still needs to remain traceable.
- The table order follows the original 11-page PDF and covers all 154 rows.
- Values, units, and tolerance expressions are preserved from the source; only table chrome is localized.
- A few OCR artifacts remain in item names or notes so the structured data can still be traced back to the PDF original.
Page 1 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 1 | Layer | 1-108 | ||
| 2 | Material Brand | SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec | ||
| 3 | Surface treatment | HASL lead-free, Immersion Gold, OSP, Immersion Tin, Immersion Silver, Plating Gold, Plating Tin, ENEPIG | ||
| 4 | Selectivity surface treatment | ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F | ||
| 5 | Solder mask color | Green, Yellow, Black, Matte black, Blue, Red, White, Matte green | ||
| 6 | Silkscreen color | White, Yellow, Black | ||
| 7 | Max board size with 2L | mm | 2000*650mm | |
| 8 | Max board size with 4L,6L | mm | 570*850mm or 1150*430mm (Exceeding 570mm shall be reviewed) | |
| 9 | Max board size with more than 8L | mm | 570*670mm or 980*430mm (Exceeding 570mm shall be reviewed) | |
| 10 | Min board size | mm | 0.5*1.0mm (thickness≤0.5mm), 1.0*2.0mm (thickness≥0.5mm) | |
| 11 | Min outline tolerance | mm | ±0.05mm (Laser Routing), ±0.1mm (Mechanical Routing) | |
| 12 | PCB Board Thickness | mm | 0.13-8mm | |
| 13 | Double side board thickness | mm | 0.13-3.6mm |
Page 2 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 14 | 4Layers board thickness | mm | 0.30-7mm | |
| 15 | 6Layers board thickness | mm | 0.6-8mm (6L), 0.8-8mm (8L), 1.0-8mm (10L), 1.0-8mm (12L) | |
| 16 | The tolerance of board thickness | mm | ±0.1mm (thickness≤1.0mm), ±10% (thickness>1.0mm) | |
| 17 | Min Drilling hole size | mm | 0.075-0.1mm (Laser), 0.15mm (Mechanical) | |
| 18 | Single Max Drilling | ww | 6.5mm (Drill Bit) | |
| 19 | Max Drilling | ww | 50mm | |
| 20 | Min PTH tolerance | mm | ±0.05mm, ±0.075mm | |
| 21 | Min NPTH tolerance | mm | ±0.05mm (Limitation+0, -0.05mm or +0.05, -0mm) | |
| 22 | Min hole tolerance | ww | ±0.075mm | |
| 23 | Max Drilling tolerancwe | ww | ±0.1mm | |
| 24 | Slot hole | mm | 0.5-6mm | |
| 25 | Min slot hole length | mm | 1.0mm | |
| 26 | Slot hole aspect ratio | mm | 1:2 | |
| 27 | Min slot hole tolerance | mm | Slot width, ±0.15mm |
Page 3 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 28 | Min slot hole tolerance | mm | Slot width direction t0.10, slot length direction ±0.15 | |
| 29 | Countersink hole angle & size | mm | Big hole 82, 90, 120 degree, dia≤10mm | |
| 30 | Countersink hole angle & size | PTH&NPTH, Big hole angle 130 degree, the dia of the large hole is not greater than 6.3mm | ||
| 31 | Min pattern width/spacing | mm | 0.075mm/0.075mm | |
| 32 | Pattern width tolerance | mm | ±20um | |
| 33 | Min pad | mm | 0.15mm | |
| 34 | FR-4 PP | 106, 1080, 3313, 2116, 7628 | ||
| 35 | Mult press blind buried hole production | Press on the same sides5 | ||
| 36 | Max bore diameter of pad hole plug hole | mm | 0.4 | Multi press blind & buried hole board |
| 37 | Min thickness of innwer | 0.05 (none blind buried hole), 0.13 (blind buried hole) | ||
| 38 | Min inner mil | 3 (18um base copper), 4 (35um base copper), ≥3mil | ||
| 39 | Inner layer treatment | Brown Oxygen | ||
| 40 | Min inner pattern spacing | mil | 5 | (105um base copper, after compensation) |
| 41 | Min inner layer pattern spacing | mil | 7 | (140um base copper, after compensation) |
Page 4 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 42 | Min innner layer pattern spacing | mil | 3 | (18um base copper, after compensation) |
| 43 | Min inner layer pattern spacing | mil | 3.5 | (35um base copper, after compensation) |
| 44 | Min inner layer pattern spacing | mil | 4 | (70um base copper, after compensation) |
| 45 | Min inner layer pattern width | mil | 5 | (105um base copper, before compensation) |
| 46 | Min inner layer pattern width | mil | 7 | (140um base copper, before compensation) |
| 47 | Min inner layer pattern width | mil | 3 | (18um base copper, before compensation) |
| 48 | Min inner layer pattern width | mil | 3 | (35um base copper, before compensation) |
| 49 | Min inner layer pattern width | mil | 4 | (70um base copper, before compensation) |
| 50 | Min outer layer pattern spacing | mil | 6 | (105um base copper, after compensation) |
| 51 | Min outer layer pattern spacing | mil | 3.0 (18um), 2.5 (12um) | (12, 18um base copper, after compensation) |
| 52 | Min outer layer pattern spacing | mil | 7 | (140um base copper, after compensation) |
| 53 | Min outer layer pattern spacing | mil | 3.5 | (35um base copper, after compensation) |
| 54 | Min outer layer pattern spacing | mil | 5 | (70um base copper, after compensation) |
| 55 | Min outer layer pattern width | mil | 8 | (105um base copper, before compensation) |
Page 5 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 56 | Min outer layer pattern width | mil | 3.5 (18um), 3 (12um) | (12, 18um base copper, before compensation) |
| 57 | Min outer layer pattern width | mil | 9 | (140um base copper, before compensation) |
| 58 | Min outer layer pattern width | mil | 4.5 | (35um base copper, before compensation) |
| 59 | Min outer layer pattern width | mil | 6 | (70um base copper, before compensation) |
| 60 | Min.spacing from pattern to pad, pad to pad for outer layer | mil | 3 (12, 18um), 3.5 (35um), 5 (70um), 6 (105, 140um) | after compensation |
| 61 | Min.outer pattern and spacing with blind/buried holes plated many times | mil | 3.5/3.5 (before compensation) | (>=2 times) |
| 62 | Min distance from inner layer edge without copper leakage | mil | 10 | |
| 63 | Min inner layer isolation width | mil | 8 | |
| 64 | Min inner layer isolation ring | mil | 8 (≤6layer), 10 (≥8layer) | |
| 65 | Min single side width of inner pad | mil | 4.5 (18, 35um, Can be partial 4), 6 (70um), 8 (105um) | (none blind buried hole) |
| 66 | Min single side width of inner pad | mil | 3 | (laser hole) |
| 67 | Impedance tolerance | % | ±5Ω (＜50Ω), ±10% (≥50Ω); ≥50Ω±5% (need to evaluate when it requests) | |
| 68 | Min BGA pad diameter | mil | 7mil | |
| 69 | Min pad diameter | mil | 12 (0.10mm Mechanical or laser drilling) |
Page 6 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 70 | Min hole copper thinckness | um | average 25, min single point≥20 | (none blind buried hole) |
| 71 | Min hole copper thinckness | um | averager 20, min single point≥18 | (blind buried hole) |
| 72 | PP thickness(min) | um | 0.075 | (only H oz base copper) |
| 73 | ENIG: gold thickness | um | 0.025-0.10 | |
| 74 | ENIG: nickle thickness | um | 3-5 | |
| 75 | Immersion silver.silver thickness | um | 0.1-0.3 | |
| 76 | Min HASL LeadFree/pure tin thickness | um | 0.4 | |
| 77 | Gold Finger:gold thickness | um | 0.25-1.3 (The required value is the thinnest point) | |
| 78 | Gold Finger:nickle thickness | um | 3-5 | |
| 79 | Flash Gold:gold thicknwess | um | 0.025-0.10 | |
| 80 | Golden finger chamfer Angle tolerance | ±5° | ||
| 81 | Golden finger chamfering margin tolerance | mil | ±5 | |
| 82 | Min gold finger length | inch | 2 | |
| 83 | Min distance between gold fingers | mil | 6 |
Page 7 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 84 | Gold finger next to the TAB does not hurt the min distance | mm | 7 | (Means automatic chamfering) |
| 85 | Long and short gold finger | Can be combined with various surface treatments | ||
| 86 | Surface treatment for long and short gold finger | Immersion gold; Flash gold | ||
| 87 | Immersion tin:Tin thickness | um | 0.8-1.5 | |
| 88 | Electroplate hard gold thick | um | 0.15-1.3 | |
| 89 | Flash Gold: nickle thickness | um | 3-5 | |
| 90 | Max borad thickness of mechanical drilling 0.10mm | mm | 0.60 | |
| 91 | Max borad thickness of mechanical drilling 0.15mm | ww | 1.20 | |
| 92 | Max borad thickness of router bit 0.25mm | mm | 5 | |
| 93 | Bow and twist capabilityw limit | % | 0.1 (need to evaluate when it requests ≤0.3) | |
| 94 | Max Dry film sealing slot | 5mm*3.0mm; More than one side of sealing hole 15mil | ||
| 95 | Min unilateral width of dry film sealing hole | mil | 10 | |
| 96 | Max diameter of dry film sealing hole | mm | 4.5 | |
| 97 | Min width of solder mask opening | mil | 8 |
Page 8 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 98 | Min solder mask thickness | um | 10 | |
| 99 | Min S/M bridge width | mil | 3 (green), 5 (other color) (base copper≤10Z) | (base coppe2-40Z, All in accordance with the 6mil) |
| 100 | Min unilateralI width of solder mask | mil | 2.5 (Allow local2mil) | |
| 101 | Min solder mask opening (sing side) | mil | 2 (Flash gold local 1.5, other allow local 1) | |
| 102 | Max diameter of ink plug hole (both side) | mm | 0.65 | |
| 103 | Thickness of solder mask ink through hole cover | um | 5/8 | |
| 104 | V-CUT Angle specifications | 20°, 30°, 45°, 60° | ||
| 105 | V-CUT (1.0<H≤1.6mm) | mm | 0.36 (20°), 0.4 (30°), 0.5 (45°), 0.6 (60°) | |
| 106 | V-CUT (1.6<H≤2.4mm) | mm | 0.42 (20°), 0.51 (30°), 0.64 (45°), 0.8 (60°) | |
| 107 | V-CUT (2.5≤H≤3.0mm) | mm | 0.47 (20°), 0.59 (30°), 0.77 (45°), 0.97 (60°) | |
| 108 | V-CUT (H≤1.0mm) | mm | 0.3 (20°), 0.33 (30°), 0.37 (45°), 0.42 (60°) | |
| 109 | V-CUT Symmetry tolerance | mil | ±4 | |
| 110 | V-CUT Angle tolerance | 0 ±5° | ||
| 111 | V-CUT Residue thickness | mil | ±4 | |
| 112 | Blue glue white mesh plug hole max diameter | mm | 2 |
Page 9 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 113 | Min single side of blue cover pattern or pad | mil | 2 | |
| 114 | Max diameter of blue plastic aluminum plug hole | mm | 4.5 | |
| 115 | Min isolation between blue glue and pad | mil | 12 | |
| 116 | Min single side carbon cap pattern | mil | 2 | |
| 117 | Min isolation between carbon and pad | mil | 8 | |
| 118 | Min isolation between carbon and carbon | mil | 12 | |
| 119 | Min gridding spacing | mil | 5 (12, 18, 35um), 8 (70um) | |
| 120 | Min gridding width | mil | 5 (12, 18, 35um), 10 (70um) | |
| 121 | Min silk width and height | width 4mil, height:23mil | (12, 18um base copper) | |
| 122 | Min silk width and height | width 5mil, height:30mil | (35um base copper) | |
| 123 | Min silk width and height | width 6mil, height:45mil | (70um base copper) | |
| 124 | Min isolation of silk and pad | mil | 6 | |
| 125 | Min test on resistance | Ω | 10 | |
| 126 | Min distance from test point to edge | mm | 0.5 |
Page 10 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 127 | Max test current | mA | 200 | |
| 128 | Max test voltage | V | 250 | |
| 129 | WNH | mil | 3.9 | |
| 130 | Min test pad | mil | 3.9 | |
| 131 | Min etch logo width | mil | 8 (12, 18um), 10 (35um), 12 (70um) | |
| 132 | Outline tolerance (edge to edge) | mil | ±4 (Complex outlin and inner grooves with this requirement shall be reviewed) | |
| 133 | Min inner angular radius | mm | 0.4 | |
| 134 | Depth control slot hole (edge) or Blind slot precision (NPTH) | mm | ±0.10 | |
| 135 | Special tolerance requirements for board thickness (No interlayer structure requirement) | mm | ≤2.0±0.1, 2.0-3.0±0.15, ≥3.0±0.2 | |
| 136 | Max ratio of plate thickness to hole | 20:1 (not include ≤0.2mm diameter, more than 12:1 shall be reviewed) | ||
| 137 | Min hole diameter | mm | 0.45 | |
| 138 | Outline method | Routing, V-CUT, Stamp-hole | ||
| 139 | Min router bit diameter of outline | mm | 0.6 | |
| 140 | Min. distance from hole to trace | mil | 6 (≤8layers), 8 (≤14layers), 9 (≤28layers) | (Not blind/buried holes) |
Page 11 / 11
| No. | Item | Unit | Data Sheet | Notes |
|---|---|---|---|---|
| 141 | Min.distance from hole to trace | mil | 9 (Press one time); 10 (press two times or three times) | (blind/buried holes) |
| 142 | Min distance from hole to trace | mil | 6 | (Laser drill, 1 or 2-step) |
| 143 | Min single-sided width for via hole pad of outer layer | mil | 4 (12, 18um) 3.5, 4.5 (35um), 6 (70um), 8 (105um), 10 (140um) | |
| 144 | Min.distance without copper exposure when outline routing | mil | 8 | |
| 145 | Maximum insulation resistance (for test) | MΩ | 100 | |
| 146 | Hole resistance test board thickness limit | mm | 0.38-5.0 | |
| 147 | Hole resistance test aperture limit | mm | min:0.62mm, max0.25mm | |
| 148 | ionic soil | ug/cm2 | ≤1 | |
| 149 | Copper stripping strength | N/cm | 7.8 | |
| 150 | Resistance weld hardnwess | H | 6 | |
| 151 | Resistance | 94V-0 | ||
| 152 | RCC material | um | copper foil:12, resin:65, 100um (complete55, 90um) | |
| 153 | Thkickness of blue glue | mm | 0.2-0.5 | |
| 154 | Min carbon pattern width | mm | 0.5mm |